The melting point of gold tin solder is 280 'c (556 c). lt has excellent thermal and conductive properties.high tensile strength, high reliability, good wettability, corrosion resistance and compatibility with other preciousmetals. lt has been widely used in aerospace, military, medical, optical communication and other fields.
Gold tin solder paste is usually used in the situation of high melting point (over 150 'c), good thermal fatiguecharacteristics, high strenath at hioh temperature, high tensie strenath, corrosion resistance and oxidationresistance, and where the solder joint will not melt in the subsequent low temperature reflow process.
Compared with gold tin preformed solder, gold tin solder paste is more flexible in use, especially suitable forhigh reliability packaging of semiconductor and microelectronic ontoelectronic devices and hiah thermaconductivitypackaging ofhigh-power devices
FeaturesFeatures:
High melting point 280'c (556 'c) solder pastehigh tensile strength.
Corrosion resistance, oxidation resistance,and compatible with other precious metals.
Good wettability and weldability
Excellent thermal and electrical conductivityin accordance with RoHS specification.
High strength and stable performance at high temperature.
Preferred packaging welding material for semiconductorand microelectronics in step reflow welding.
Parameter:
Packaging:
Matters needing attention:
1.Product storage:refrigerator storage0-30℃℃.
2.Shelf life: 6 months.
