High-Reliability Demands for Automotive & Aerospace

Innovative High-Temperature Solder Solutions for Next-Gen Technologies

As industries move toward electric vehicles (EVs), advanced aerospace electronics, and high-frequency 5G applications, the demand for high-reliability solder solutions has never been greater. With the increasing adoption of SiC (Silicon Carbide) and GaN (Gallium Nitride) power modules, finding the right high-temperature solder is critical for long-term performance and durability.

1. The Growing Need for High-Reliability Solder in EV Power Modules

The global EV market is expected to grow at a CAGR of 17.8%, reaching $1.1 trillion by 2030 (Source: MarketsandMarkets). As more manufacturers integrate SiC and GaN power devices into EV powertrains, the demand for high-temperature, oxidation-resistant solder solutions continues to rise.

Traditional Sn-Pb solders struggle with thermal cycling and electromigration, leading to reliability issues in high-voltage EV applications. Advanced Au-Sn solder and Transient Liquid Phase (TLP) bonding offer superior thermal stability, mechanical strength, and oxidation resistance, making them ideal for EV inverters, converters, and onboard chargers.